| Product
| Description
| Available Form |
Work Life
| Shelf Life
| Comments
| Thermal Conductivity in W/m-°k
| Lap Shear Strength in psi
| Cure Time/Temp
| Tg
| Color
| Linear CTE, x 10-6/°C
|
| F2591 |
F2591 is an electrically isolating material that features, a V-0 flammability rating, good chemical, heat, and moisture resistance. |
Film
Preform
B-Stageable Liquid
|
1 mo. @ 20°C |
3 mo. @ 10°C / 12 mo. @ -40°C |
V0 Flammability Rating |
N/A |
1500 to Aluminum
|
60 @ 150°C |
140°C |
Purple |
N/A |
| T2381 |
Highly thermallly conductive B-staged film adhesive specially formulated for high temperature applications. Chemical resistance. Good adhesion to Aluminum. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
High temperature applications |
2.6 |
2000 to Aluminum
|
30 @ 150°C |
87/205°C |
Grey |
N/A |
| T2581 |
A highly thermally conductive and electrically insulative single component screen printable adhesive. Provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with low CTE, and a high Tg. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
3 mo. @ 10°C or 12 mo. @ -40°C |
Excellent adhesion to ceramic and metal |
1.7 |
1750 to Aluminum
1200 to Gold
1632 to Nickel
2680 to Copper
1940 to Brass
1880 to 316 Stainless Steel
|
30 @ 150°C |
140°C |
Grey |
N/A |
| T2723 |
TechFilm T2723F is a thermally conductive and electrically insulative, B-staged film adhesive. It features a relatively low coefficient of thermal expansion moderately high glass transition temperature and good adhesion to various substrates. TechFilm T2723F will cure at temperatures above 90°C. |
Film
Preform
B-Stageable Liquid
|
3 days @ 20°C |
12 mo. @ -40°C |
Low temp. fast cure, adhesion to a broad range of substrates |
0.6 |
3550 to Aluminum
1650 to Nickel
3100 to Copper
3250 to Brass
4250 to 316 Stainless Steel
|
15 @ 150°C |
98°C |
Cream |
N/A |
| T2726 |
T2726 is a thermally conductive and electrically insulative, B-staged film adhesive cast from 100% solids. It also features good chemical, heat, and moisture resistance and low outgassing. |
Film
Preform
|
4 days @ 20°C |
2 mo. @ -10°C / 12 mo. @ -40°C |
Low outgassing. Fast Cure. |
0.31 |
2120 to Aluminum
|
15 @ 150°C |
132°C |
Cream |
Below Tg = 64
Above Tg = 305 |
| TF E2213F |
A low outgassing adhesive especially suited for EMI/RF grounding applications. Excellent adhesion to gold or gold plated substrates and features good chemical, heat, and moisture resistance.
|
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
2wks@ 10°C / 12 mo. @ -40°C |
Excellent adhesion to difficult to bond substrates |
1.3 |
2300 to Aluminum
2850 to Gold
2300 to Nickel
|
60 @ 150°C |
108°C |
Silver |
Below Tg = 58
Above Tg = 360 |
| TF E2214F |
Specifically formulated for bonding to gold or gold plated substrates. E2214 is especially suited for replacing solder on non-solderable substrates and EMI/RFI applications. It features low outgassing, good chemical, heat, and moisture resistance |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
Meets Mil spec 883, Method 5011 |
1.3 |
2150 to Aluminum
1700 to Gold
1700 to Nickel
|
60 @ 150°C |
106°C |
Silver |
Below Tg = 57
Above Tg = 347 |
| TF E2551 |
An electrically conductive B-staged film adhesive specially formulated for Aluminum, stainless steel and Copper grounding applications where galvanic corrosion is a concern. |
Film
Preform
B-Stageable Liquid
|
One Month @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
Minimizes galvanic corrosion |
0.55 |
2770 to Aluminum
|
60 @ 150°C |
130°C |
Gray - Green |
N/A |
| TF E3013 |
Single component silver filled liquid adhesive specifically formulated for bonding to gold or gold plated, nickel, and copper substrates. TechFilm E3013 will cure at temperatures above 120°C. |
Liquid
Paste
|
20 days @ 20°C |
6 mo. @ -40°C / 21 days @ Room Temp. |
Excellent adhesion to difficult to bond substrates |
1 |
1650 to Aluminum
1460 to Gold
1000 to Nickel
|
30 @ 150°C |
83°C |
Silver |
N/A |
| TF E3015 |
Single component pre-mixed and frozen silver filled adhesive. E3015 is a snap cure syringe or screen printable liquid adhesive featuring good chemical, heat, and moisture resistance with good adhesion to gold and nickel substrates. |
Liquid
Paste
|
8 hours @ 20°C |
6 mo. @ -40°C / 1 day @ Room Temp. |
Snap cure, Electrically conductive |
1.3 |
1400 to Aluminum
1400 to Gold
|
5 @ 150°C |
80°C |
Silver |
N/A |
| TF T2121 |
High performance urethane modified epoxy featuring high bond strength. Cures at temperatures above 90°C. Standard formulation contains a 1.5 or 3.0 mil non-woven glass reinforcement for ease of handling. Available without a reinforcing layer. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
Good for adhesion to plastics |
0.45 |
3000 to Aluminum
to Plastics
to 316 Stainless Steel
|
30 @ 150°C |
107°C |
Cream |
Below Tg = 65
Above Tg = 312 |
| TF T2122 |
Fast curing, low temperature cure. Urethane modified epoxy, specially formulated for bonding to plastic substrates. Urethanes by their nature are better to stick to plastics than an epoxy based material. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
Good for adhesion to plastic |
0.41 |
2525 to Aluminum
2300 to Nickel
4300 to Copper
5300 to Brass
to Plastics
5900 to 316 Stainless Steel
|
30 @ 150°C |
81°C |
Cream |
N/A |
| TF T2222F |
Excellent adhesion to gold, nickel, invar and other hard to bond substrates. High thermal conductivity and electrically insulative film. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
3 mo. @ -10°C / 12 mo. @ -40°C |
High bond strength to hard to bond substrates |
0.75 |
3000 to Aluminum
2950 to Gold
3050 to Nickel
4250 to Copper
5250 to Brass
6250 to 316 Stainless Steel
|
60 @ 150°C |
112°C |
Cream |
Below Tg = 42
Above Tg = 176 |
| TF T2232 |
TechFilm T2232F is a high performance, high strength, highly thermally conductive\electrically insulating, B-staged film adhesive. It features a relatively low coefficient of thermal expansion, good adhesion to gold and high strength. |
Film
Preform
B-Stageable Liquid
|
14 days @ 20°C |
3 mo. @ -10°C / 12 mo. @ -40°C |
Good chemical, heat, and moisture resistance. |
1.2 |
2650 to Aluminum
2350 to Gold
|
30 @ 150°C |
117°C |
Grey |
Below Tg = 47
Above Tg = 245 |
| TF T2321 |
Formulated specifically for high temperature applications T2321P is a low outgassing single component screen printable thermally conductive and electrically insulative adhesive. T2321 provides excellent chemical and moisture resistance while providing good adhesion to both metal and plastic substrates. |
Film
Preform
B-Stageable Liquid
|
30 days @ 20°C |
3 mo. @ -10°C / 12 mo. @ -40°C |
Good for High Temperature Applications |
0.9 |
1850 to Aluminum
|
15 @ 140°C |
205°C |
Cream |
Below Tg = 46
Above Tg = 220 |
| TF T2422 |
TechFilm T2422F is a high performance, electrically insulative, B-staged film adhesive. It features a a rubber modified polymer backbone with moderately high glass transition temperature and good chemical resistance and adhesion to various substrates. |
B-Stageable Liquid
|
7 days @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
High performance, high glass transition |
0.4 |
3800 to Aluminum
3250 to Gold
|
15 @ 150°C |
93°C |
Cream |
N/A |
| TF T2521 |
T2521 provides excellent adhesion to a broad range of substrates, good chemical, heat, and moisture resistance along with relatively low CTE, and a fairly high Tg. |
Film
Preform
B-Stageable Liquid
|
30 days @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
Excellent Adhesion to a broad range of substrates |
0.9 |
2100 to Aluminum
2140 to Nickel
4200 to Copper
5300 to Brass
to Plastics
3600 to 316 Stainless Steel
|
60 @ 150°C |
130°C |
Cream |
Below Tg = 48
Above Tg = 267 |
| TF T2526 |
Low out-gassing, electrically insulative film that has a relatively low CTE, high Tg, and good adhesion to various substrates. Features good chemical, heat, and moisture resistance. Cure at temperatures above 130°C. |
Film
Preform
|
30 days @ 20°C |
3 mo. @ -10°C / 12 mo. @ -40°C |
Low out-gassing |
0.31 |
2120 to Aluminum
|
60 @ 150°C |
121°C |
Cream |
N/A |
| TF T2531 |
High thermal conductivity, relatively low CTE, fairly high Tg., good chemical, heat, and moisture resistance. Cures at temperatures above 130°C. |
Film
Preform
B-Stageable Liquid
|
30 days @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
High Thermal Conductivity |
1.3 |
1900 to Aluminum
|
60 @ 150°C |
130°C |
Grey |
Below Tg = 47
Above Tg = 245 |
| TF T2722F |
Low temperature cure, highly chemical resistant material providing high bond strength curing at temperatures above 90°C. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
Fast cure, high bond strength |
0.4 |
3800 to Aluminum
3250 to Copper
|
60 @ 130°C |
93°C |
Cream |
N/A |
| TF T2731 |
High performance, electrically insulative, low curing temperature material with good adhesion to various metals, including gold. |
Film
Preform
B-Stageable Liquid
|
5 days @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
Fast curing |
0.75 |
2550 to Aluminum
2050 to Brass
to 316 Stainless Steel
|
30 @ 130°C |
102°C |
Grey |
N/A |
| TF T2736 |
Fast curing, low out-gassing and low temperature curing material. Electrically insulative film with a relatively low CTE, high Tg. good adhesion to various substrates and good chemical, heat, and moisture resistance. |
Film
Preform
|
4 days @ 20°C |
12 mo. @ -40°C |
Fast, Low Tempurature cure. Low out-gassing |
0.45 |
1800 to Aluminum
to 316 Stainless Steel
|
30 @ 120°C |
124°C |
Cream |
Below Tg = 60
Above Tg = 280 |
| TF T2781 |
Highest thermally conductive\electrically insulating, fast cure material. Features good chemical, heat, and moisture resistance. |
Film
Preform
B-Stageable Liquid
|
2 days @ 20°C |
12 mo. @ -40°C |
High Thermal Conductivity |
2.63 |
2500 to Aluminum
1200 to Gold
2600 to Copper
1430 to Brass
1110 to 316 Stainless Steel
|
30 @ 150°C |
101°C |
Grey |
N/A |
| TF T3222 |
A high performance thermally conductive syringe dispense adhesive specially formulated for bonding gold, gold plated substrates, aluminum and other to difficult to bond metalic surfaces. T3222 also provides excellent chemical, heat, and moisture resistance. |
Liquid
Paste
|
8 hours @ 20°C |
12 mo. @ -40°C |
High bond strength |
0.5 |
3100 to Aluminum
3000 to Gold
|
60 @ 150°C |
86°C |
Tan |
N/A |
| TF T3583 |
Highest thermally conductive syringe dispense adhesive. T3583 is specifically formulated for aluminum heat sinks to a variety of inorganic substrates in high thermal K applications. T3583P also provides excellent chemical, heat, and moisture resistance and a high dielectric constant. |
Liquid
Paste
|
7 days @ 20°C |
12 mo. @ -40°C |
High Thermal Conductivity |
2.5 |
4500 to Aluminum
1400 to Gold
2020 to Nickel
3630 to Copper
4310 to Brass
2500 to 316 Stainless Steel
|
60 @ 150°C |
80°C |
Grey |
N/A |
