| Product
| Description
| Available Form |
Work Life
| Shelf Life
| Comments
| Thermal Conductivity in W/m-°k
| Lap Shear Strength in psi
| Cure Time/Temp
| Tg
| Color
| Linear CTE, x 10-6/°C
|
| E3213 |
Single component silver filled syringe or screen printable adhesive formulated specifically for high temperature performance. E3213 delivers excellent adhesion to Aluminum and Gold substrates with good chemical, heat, and moisture resistance. |
Liquid
Paste
|
2 days @ 20°C |
6 mo. @ -40°C / 2 days @ Room Temp. |
Excellent adhesion to difficult to bond substrates |
N/A |
2400 to Aluminum
2000 to Gold
|
60 @ 150°C |
144°C |
Silver |
N/A |
| TF E2213F |
A low outgassing adhesive especially suited for EMI/RF grounding applications. Excellent adhesion to gold or gold plated substrates and features good chemical, heat, and moisture resistance.
|
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
2wks@ 10°C / 12 mo. @ -40°C |
Excellent adhesion to difficult to bond substrates |
1.3 |
2300 to Aluminum
2850 to Gold
2300 to Nickel
|
60 @ 150°C |
108°C |
Silver |
Below Tg = 58
Above Tg = 360 |
| TF E2214F |
Specifically formulated for bonding to gold or gold plated substrates. E2214 is especially suited for replacing solder on non-solderable substrates and EMI/RFI applications. It features low outgassing, good chemical, heat, and moisture resistance |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
12 mo. @ -40°C |
Meets Mil spec 883, Method 5011 |
1.3 |
2150 to Aluminum
1700 to Gold
1700 to Nickel
|
60 @ 150°C |
106°C |
Silver |
Below Tg = 57
Above Tg = 347 |
| TF E2313F |
Developed specifically for high temperature applications E2313 is a high performance, low outgassing electrically conductive paste adhesive. The adhesive features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. |
Film
Preform
B-Stageable Liquid
|
30 days @ 20°C |
2 mo. @ 10°C/ 12 mo. @ -40°C |
High temperature applications |
N/A |
1500 to Aluminum
|
15 @ 150°C |
>180°C |
Silver |
Below Tg = 55
Above Tg = 340 |
| TF E2514 |
TechFilm E2514F is a high performance, electrically conductive, B-staged film adhesive developed for general purpose grounding applications. It features a relatively low coefficient of thermal expansion, a high glass transition temperature and good adhesion to various substrates. |
Film
Preform
B-Stageable Liquid
|
30 days @ 20°C |
2 mo.@ -10°C / 12 mo. @ -40°C |
Good chemical and thermal degradation resistance. |
N/A |
1500 to Aluminum
1100 to Gold
|
60 @ 150°C |
115°C |
Silver |
Below Tg = 57
Above Tg = 350 |
| TF E2551 |
An electrically conductive B-staged film adhesive specially formulated for Aluminum, stainless steel and Copper grounding applications where galvanic corrosion is a concern. |
Film
Preform
B-Stageable Liquid
|
One Month @ 20°C |
6 mo. @ -10°C / 12 mo. @ -40°C |
Minimizes galvanic corrosion |
0.55 |
2770 to Aluminum
|
60 @ 150°C |
130°C |
Gray - Green |
N/A |
| TF E2713F |
Fast curing, highly chemically resistant film. Features a low CTE and high electrical conductivity. Good for difficult to bond substrates. |
Film
Preform
B-Stageable Liquid
|
3 days @ 20°C |
1 mo.@ -10°C / 12 mo. @ -40°C |
Fast Curing |
N/A |
1900 to Aluminum
1900 to Gold
2710 to Nickel
3000 to Copper
2500 to Brass
|
15 @ 165°C |
107°C |
Silver |
N/A |
| TF E2771CF3 |
TechFilm E2771CF3 is a three thousands of an inch film supported with two thousands of an inch carbon non-woven mesh. It is a high performance electrically conductive B-staged film adhesive specially formulated for bonding to gold, brass and copper substrates. |
Film
Preform
B-Stageable Liquid
|
7 days @ 20°C |
1 mo. @ 10°C / 12 mo. @ -40°C |
EMI/RFI alternative |
N/A |
2900 to Aluminum
1900 to Gold
2950 to Copper
|
30 @ 150°C |
114°C |
Dark Grey |
N/A |
| TF E3013 |
Single component silver filled liquid adhesive specifically formulated for bonding to gold or gold plated, nickel, and copper substrates. TechFilm E3013 will cure at temperatures above 120°C. |
Liquid
Paste
|
20 days @ 20°C |
6 mo. @ -40°C / 21 days @ Room Temp. |
Excellent adhesion to difficult to bond substrates |
1 |
1650 to Aluminum
1460 to Gold
1000 to Nickel
|
30 @ 150°C |
83°C |
Silver |
N/A |
| TF E3015 |
Single component pre-mixed and frozen silver filled adhesive. E3015 is a snap cure syringe or screen printable liquid adhesive featuring good chemical, heat, and moisture resistance with good adhesion to gold and nickel substrates. |
Liquid
Paste
|
8 hours @ 20°C |
6 mo. @ -40°C / 1 day @ Room Temp. |
Snap cure, Electrically conductive |
1.3 |
1400 to Aluminum
1400 to Gold
|
5 @ 150°C |
80°C |
Silver |
N/A |
