A customer was looking to bond their piezoelectric sensor to their stainless steel component for a structural bond. They needed conductivity across the piezoelectric ceramic yet electrical isolation from the stainless steel substrate. We offered a one step solution by coating one side of a 1 mil kapton film with an electrically conductive material, and the other side with an electrically isolating material, thereby completing the bond between the two substrates, but only allowing conductivity to one of the substrates.
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