Our customer wanted to cut down on cross talk between connectors on a mainframe computer. They needed a low cost, low resistance conductive material that would act as an EMI/RFI shield. E2771, which contains a graphite filler, was coated on both sides of a carbon mesh to create the film. We then utilized the customer's CAD drawing to create a die cut preform which bonded to one side of the connector eliminating the need for a hard shell EMI/RFI shield. This allowed the preform to function as shield itself. To aid in manufacturability we adjusted the spacing of each preform on the roll to match the customer's roll of incoming stock, then die cut fiducials in the preform to match the alignment pins on the production press. Markets: Microwave, Telecommunication, Cell Phone, Consumer and Industrial Electronics
This structural application required a high dissipation factor in an RF application. Barium Titanate filler was added to our I2202 to increase the dissipation factor of our structural material to allow the RF waves to pass through the adhesive. Markets: Microwave, Telecommunication, Cell Phone, Consumer and Industrial Electronics
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