A manufacturer of print heads for high end ink jet printers needed an adhesive to bond two grooved liquid crystalline polymer to an invar substrate. Once the parts are mated they act as an ink reservoir with flow channels that direct ink along a path to the firing head. Any adhesive used on the part cannot migrate, block the channels, or deteriorate when exposed to the ink. The liquid epoxy they had been using did not meet their requirements. TechFilm developed a thermally conductive, structural material that bonded the liquid crystalline polymer to the invar substrate without migrating into the intricate channel design. The material offered excellent chemical resistance and delivered needed thermal conductivity, directing heat away from the print head.
A customer building computer mainframes needed a thermally conductive adhesive to conduct the heat away from the copper piping to the heat dissipating aluminum fins. Previously the customer was using a liquid which gave voids and inconsistencies in bond line thickness causing inconsistent thermal conductivity. Our T2781 gave them a thermal conductivity performance of 2.63 w/m°K and delivered a consistent and predictable value of heat absorption. Markets: Computers, Consumer Electronics, Auto Electronics, Heat sinks, Heat pipes and Thermal spreaders
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